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Semiconductor manufacturers are searching for a material to use on equipment fixturing surfaces to handle silicon wafers. Current solutions are time consuming, resulting in high scrap rate due to damaged parts and residue.

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Industry Solutions


CMP Polishing & Surfacing

Current adhesives leave residue resulting in killer defects on fabricated wafers and significant yield losses. This deficiency increases time required to replace pads, resulting in lower throughput in production. This manual cleaning process adds costs without adding value. Furthermore, such adhesives typically offer limited repeatability.


Wafer Handling

Many manufacturing environments need gripping and friction materials that enable rapid parts movement, as well as handling and fixturing, and are also dry, residue-free and able to secure very smooth, tough-to-hold parts. Solutions are limited, especially for new material coatings that designers want to use.


Setex Tape has fiber tips that are in contact with a release film. This film should be removed before evaluation of samples and be replaced when samples are not in use.


The strength of Setex Tape depends on the number of microfiber tips in contact with the surface and amount of contact time. We recommend applying microfiber tips with firm pressure to achieve optimal surface contact.

Get a grip on your product design and manufacturing processes by partnering with Setex Technologies.